
C35 Application Note
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RoHS Compliant www.semileds.com
C35 Application Note V1.3
Subject to change without notice
Page
9
ReflowInformation
The LEDs can be soldered using the parameters listed below. As a general guideline, the users are
suggestedtofollowtherecommendedsolderingprofileprovidedbythemanufacturerofthesolderpaste.
Although the recommended soldering conditions are specified in the list, reflow soldering at the lowest
possibletemperatureispreferred
fortheLEDs.
ProfileFeature ForsolderwithPb ForLeadfreesolder
Temprampuprate
(TsmaxtoTp)
3℃/secondmax. 3℃/secondmax.
Pre‐heat
- Min.Temp(Tsmin)
- Max.Temp(Tsmax)
- Time(tsmintotsmax)
100℃
150℃
60‐120seconds
150℃
200℃
60‐180seconds
StableCondition:
- Temp.(TL)
- Time(tL)
183℃
60‐150seconds
217℃
60‐150seconds
PeakTemp.(Tp)
215℃ 260℃
TimeinPeakTemp.(tp) 10‐30seconds 20‐40seconds
Rampdownrate
6℃/secondmax. 6℃/secondmax.
Timefrom25℃ toPeaktemp.
6minutesmax. 8minutesmax.
Notes:Afterreflowprocess,theLEDlenssurfacemaybepollutedbyfluxorcontaminationwhichmay
impacttheLEDopticalperformance.ItissuggestedtocleanthelenssurfacebyalcoholorIPA.Pleaserefer
to“C35LEDCleaning”.
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