Sharp EL-6560 Spezifikationen PDF herunterladen (Seite 96)

7. Pull the heat sink away from the side of the computer to remove it (3).

NOTE: For discrete models, thoroughly clean thermal material from the surfaces of the system

board components (1)(3)(5), the heat sink (2)(4)(6) each time you remove the heat sink. All heat sink

and processor spare part kits include thermal material.

In the following illustration, the location denoted by callout (2) on the heat sink uses thermal grease.

The location denoted by callout (4) on the heat sink uses a GPU thermal pad. The location denoted

by callout (6) on the heat sink uses a PCH thermal pad.

88 Chapter 4 Removal and replacement procedures

1 2 ... 91 92 93 94 95 96 97 98 99 100 101 ... 159 160

Keine Kommentare

Sharp EL-6560 Spezifikationen Seite 96